Thermal adhesive

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Thermal adhesive is a type of thermally conductive glue used for electronic components and heatsinks. Thermal adhesive is similar to thermal paste in that it is used for transferring heat from one surface to another. It usually consists of two separate parts that are mixed together and applied to the surfaces to be bonded. This is commonly used to bond heatsinks to motherboard chipsets and video card processors where there are no mounting holes to clamp a heatsink down.

Thermal adhesive is usually applied by the manufacturer of the part to which it is applied, although it is also sold to the general public.

See also


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  • This page was last modified on 16 November 2008, at 18:58.

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